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    Basic Function & Stamping Heat Sinks

    Basic Stamping Heat Sinks provide an economical solution to low power density thermal problems. They include BGA, simple Stamping heat sinks. Stamping is a high volume manufacturing techniques, and it can ensure the lowest cost.


      Why Basic Function & Stamping Heat Sinks?

      Lowest cost thermal solutions

      Ideal for Printed Circuit Boards

      Simple assembly processing and reduce cost

      Easy manufacturing process

     

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