The electronic products available to the consumer in this digital age are as varied as the semi-conductors that drive them.
It seems every generation in the product development cycle must produce designs that are twice as fast, half the size and half the cost of the previous generation. Innovation in this industry means giving consumers products they are clamoring for and products they have not even dreamed of. Thermal Management of today's products must meet the challenges presented by the growing processing power and shrinking size of electronic devices at a cost that will drive adoption in the market.
Historically the personal computing space has been dominated by desktop and laptop systems. Innovative approaches to value engineering are necessary to keep these market segments relevant in the face of a market migration to tablets and smart phones. These smart devices are becoming more powerful with every generation and require new approaches to thermal management that include rethinking thermal components, materials and system integration.
The gaming industry pushes micro processing to its limits but with two very different approaches to the market. When processor speed is paramount gamers turn to over-clocking personal computers. Top performing air or liquid cooled systems are given more space in large desktop enclosures. In contrast, dedicated gaming consoles have mass market appeal by providing maximum processor and graphic performance at the best value. Gaming system designers are cost conscious because the console is simply a platform to deliver the gaming and other content.
The processing power for today's home entertainment devices is increasing as the home entertainment experience becomes more connected to on-line content. Media management and delivery systems, set-top boxes and even televisions themselves require new thermal solutions. The home entertainment environment and the competitiveness of the market require thermal solutions that are both quiet and cost effective. The variety of form factors used in this space creates unique challenges in thermal design.